Ring removal stage require the dicing tape cut according to specification:
On single wafers
Silicon wafers:
– 100mm diameter, 525um reduced to 100um
– 150mm diameter, 625um reduced to 200um

GaN 2″ wafer (mounted on frame), 320um reduced to 100um
Fused silica wafer, 525um reduced to 200um
Pyrex wafer (borosilicate), 525um reduced to 200um
Glass wafer (sodalime), 525um reduced to 200um
On stacked wafers
Pyrex/Si anodic bonding, Si thinning down to 30um
Si/Si wafers mounted with quickstick 135, Si thinning down to 50um
Si/glass wafers bonded with parylene, Si thinning down to 50um
Si/Si wafers mounted with spined glue, Si thinning down to 50um
Chips on UV-tape
GaN 2cmX2cm, 320um reduced to 100um
Silicon 1cmx1cm, 380um thinning down to 50um
Smaller Si chips (few mm), 380um thinning down to 50um
Fused silica 1cmx1cm, 380um thinning down to 50um
Pyrex 1cmx1cm, 380um thinning down to 50um